Micro Edge Process Co., Ltd.

NEWS & TOPICS ニュース・お知らせ

2024.06.27: We are pleased to announce that we newly open a laser processing center due to business expansion. We are able to accept the demonstration of laser machine and sample testing.
2024.04.27: OPIE 2024 exhibition was held at Pacifico Yokohama from 24th - 26th of April. We had a booth to show our technologies.
2023.08.01: Due to the expansion of our business, we have expanded our rooms. We will be able to do much of our work in a larger work space to meet your needs.
2023.07.07: We have relocated to Room 703 in Building 2 as of July 1st, 2023. * Our phone, fax, and email remain unchanged.
2023.04.06: We exhibited at "OPIE'23" held at Pacifico Yokohama from April 19th to April 21st, 2023.
2022.10.05: We have been selected for the Manufacturing Productivity Improvement Promotion Grant. [Advancement of Laser Technology for Fine Electronic Device Bonding and Packaging]
2022.08.10: We have been selected for the Sagamihara City DX Promotion Support Grant. [Development of AI-based Fine Laser Processing Condition Management and Prediction System]
2022.04.27: We have registered for the "Partnership Building Declaration".
2022.03.14: We will be exhibiting at "OPIE'22" held at Pacifico Yokohama from April 20th to April 22nd, 2022!
2022.01.13: We have uploaded the "Micro Machining" page.
2021.06.23: We will be exhibiting at "OPIE'21" held at Pacifico Yokohama from June 30th to July 2nd, 2021!
2021.05.01: We have moved from Room 203 to a larger Room 210 within the Sagamihara Industrial Creation Center.
2020.08.20: The English version of the website has been released.
2020.08.20: Click here for the Japanese version of the website.

Introduction of Micro Edge Process

Micro Edge Process has been engaged in semiconductor-related, electricity and electronics-related device, measurement, and parts over the years.

The company was established in 2015 utilizing the know-how. We want to continuously respond to customers' requests with original technologies, information, and production network to grow up.

The characteristics of Micro Edge Process are proposal and manufacturing of viewing systems, measuring instruments, laser processing machine, optical components based on micro bonding technology using laser, and processing by commissioning using various processing machines.

Especially, we have developed devices using laser microfabrication with manufacturers listed with first section of the Tokyo Stock Exchange in the silicon society over the years.

We have responded to customers' requests based on Micro Edge Process's advantage, optical technology and experiences for parts bonding at level of microns.

Of course, we are also developing the equipment related to production such as observation optical system attached to laser processing device, jigs, and tools.

If you have any trouble, please consult us.

Laser micro processing

Ultra-fine Laser Welding	High-Quality Micro Hole Machining	Micro Multi-Hole Machining

Material: Copper (Cu) Method: Keyhole Welding Precision welding of high-demand copper	Material: Glass Thickness: 0.3mm Width: 80μm Length : 2mm	Hole Diameter: Φ0.12±0.005mm Hole Pitch: 0.25±0.005mm Number of Holes: 200 Application: Tester components

Products

Semiconductor Laser MPR450	3-Axis Blue Head MPR450LH-COART	Semiconductor Laser Robot System

→ Detailed Page	→ Detailed Page	→ Detailed Page

Information of newly developed products

Newly developed products

"Coaxial observation head with temperature monitor"

3 axes; laser, temperature sensor, camera are coaxially integrated.

It enables correct sensing of the temperature within laser irradiated area by using the temperature control unit at the same time.

You can observe the irradiation area on the monitor by using the coaxial camera.

For infrared semiconductor laser

For blue semiconductor laser

Newly developed products

"Temperature control unit"

This is a unit that aquire the measured value of temperature sensorat high speed and is able to control the output of laser light source for "temperature feedback control".

This unit can reduce the complicated laser output optimization by just setting the target temperature.

Temperature control unit catalogue (PDF)
Display the technical report (2) PDF file

Unit main body

Screen of control software

Information of new products

New products

"High-output fiber bonding type blue semiconductor laser"

This ishigh-output blue laser using wavelength 450nm of metallic materials such as gold (Au) and copper (Cu) whose light absorption rate is high.

In addition to maximum output 20W type,50W type and 100W type are lined up.

This is a waveband that is highly expected for various use applications such as soldering and welding.

Demo machine and peripheral equipment are lined up.

Please feel free to contact us.

Display the technical report (1) PDF file

Blue semiconductor laser

Laser micro bonding technology, laser microfabrication, laser welding, optical components, design and fabrication of optical system

Micro Edge Process Co., Ltd.
Sagamihara Incubation Center SIC2-703,
5-4-30, Nishihashimoto, Midori-ku, Sagamihara-shi,
Kanagawa-ken, 252-0131, Japan